1·Apart from pre-treatment products: powder paint, stripped from agents and removing wax water, antirust oil; Electronics and solder flux.
烤漆前处理产品：除油粉、漆剂、油除蜡水、锈油等；电子、锡助焊剂。
2·To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
3·A method of improving the solder flux resistance of a silicone gel, and a method of forming a silicone gel with excellent solder flux resistance, both methods using the above composition.
提供了改进有机硅凝胶的耐助焊剂能力的方法和形成具有优异耐助焊剂能力的有机硅凝胶的方法，两种方法都采用上述组合物。
4·The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
5·Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
6·Will the sample needs of solder part in flux in 5 to 10 seconds.
将样品需要焊锡的部分浸入助焊剂中5到10秒。
7·Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.
下列因素是必须被考虑的：包括合金的类型、锡粉的粒径大小以及助焊剂的类型。
8·The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
9·The oxide thinning process could not only reduce the coalescent resistance of solder alloys during melting but also make the complete removal of oxide with flux easier.
焊料表面氧化层厚度的减小能够降低焊接过程中焊料粉末的结合阻力，助焊剂更容易将氧化物清除，有助于焊料合金的融合。
10·The factors affecting soldering ability of rosin-based flux for lead-free solder paste, and the factors affecting erosion resistance are discussed.
实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。